| Price | Negotiable |
| MOQ | negotiate |
| Delivery Time | 15-20work days |
| Brand | VKD |
| Place of Origin | zhuzhou |
| Model Number | Cu70w30 |
| Packaging Details | paper,then paper boxs |
| Payment Terms | L/C, D/A, D/P, T/T, Western Union, MoneyGram |
| Supply Ability | 5tons/month |
| Place of Origin | zhuzhou | Packaging Details | paper,then paper boxs |
| Product Name | Tungsten Copper Heat Sink | Model Number | Cu70w30 |
| Hardness | 115-260 | Supply Ability | 5tons/month |
| Density | 11.85 - 16.75g/cc | Brand Name | VKD |
| Payment Terms | L/C, D/A, D/P, T/T, Western Union, MoneyGram | Hardness:Product Standard: | ASTM B 702 |
| Price | Negotiable | Delivery Time | 15-20work days |
| Minimum Order Quantity | negotiate | Class | W50/Cu50 - W90/Cu10 |
| Bending Strength | 790-1160 |
Low Expansion Copper Tungsten Parts / Tungsten Copper Heat Sink 115-260 Hardness
Description:
Tungsten copper heat sink is a composite of tungsten and copper, so both the thermal advantages of copper and the very low expansion characteristics of tungsten can be adjusted to meet different requirements.
Advantages:
1. Excellent flatness, surface finish, and size control
2. Semi-finished or finished (Ni/Au plated) products available
Application:
They are extensively used as thermal mounting plates, chip carriers, tungsten copper flanges, and frames for RF, light emitting diodes and detectors, laser diode packages like pulse, single emitter, bars and complex carriers for optoelectronics amplifiers, receivers, transmitters, tunable lasers, etc.
Product Properties:
| Grade | W Content | Density g/cm3 |
Coefficient of thermal Expansion ×10-6 (20℃) |
Thermal conductivity W/(M·K) |
| 90WCu | 90±2% | 17.0 | 6.5 | 180 (25℃) /176 (100℃) |
| 85WCu | 85±2% | 16.4 | 7.2 | 190 (25℃) / 183 (100℃) |
| 80WCu | 80±2% | 15.65 | 8.3 | 200 (25℃) / 197 (100℃) |
| 75WCu | 75±2% | 14.9 | 9.0 | 230 (25℃) / 220 (100℃) |
| 50WCu | 50±2% | 12.2 | 12.5 | 340 (25℃) / 310 (100℃) |
Welcome your inquiry.
