Price | Negotiation |
MOQ | 1 |
Delivery Time | 3-4days |
Brand | Original |
Place of Origin | Original |
Certification | Original |
Model Number | LAE5UM-25F-7BG381E |
Packaging Details | carton box |
Payment Terms | TT |
Supply Ability | 100 |
Operating Temperature | -40°C ~ 125°C (TJ) | Place of Origin | Original |
Packaging Details | carton box | Number of LABs/CLBs | 3000 |
Total RAM Bits | 1032192 | Number of I/O | 197 |
Model Number | LAE5UM-25F-7BG381E | Supply Ability | 100 |
Certification | Original | Brand Name | Original |
Payment Terms | TT | Price | Negotiation |
Delivery Time | 3-4days | Voltage - Supply | 1.04V ~ 1.155V |
Minimum Order Quantity | 1 | Number of Logic Elements/Cells | 24000 |
HCPL-2611-020E Logic Output Optoisolator 10MBd Schottky Clamped 5000Vrms 15kV/µs
TYPE | DESCRIPTION |
Category | Integrated Circuits (ICs) |
Embedded | |
FPGAs (Field Programmable Gate Array) | |
Mfr | Lattice Semiconductor Corporation |
Series | LA-ECP5 |
Packaging | Tray |
Number of LABs/CLBs | 3000 |
Number of Logic Elements/Cells | 24000 |
Total RAM Bits | 1032192 |
Number of I/O | 197 |
Voltage - Supply | 1.04V ~ 1.155V |
Mounting Type | Surface Mount |
Operating Temperature | -40°C ~ 125°C (TJ) |
Package / Case | 381-FBGA |
Supplier Device Package | 381-CABGA (17x17) |
Base Product Number | LAE5UM-25 |
Features of LAE5UM-25F-7BG381E
*
Higher
Logic
Density
for
Increased
System
Integration
*
12K
to
44K
LUTs
*
197
to
203
user
programmable
I/Os
*
Embedded
SERDES
*
270
Mb/s,
up
to
3.2
Gb/s,
SERDES
interface
(ECP5UM
Automotive)
*
Supports
eDP
in
RDR
(1.62
Gb/s)
and
HDR(2.7
Gb/s)
*
Up
to
four
channels
per
device:
PCI
Express,Ethernet
(1GbE,
XAUI,
and
SGMII,),
and
CPRI
*
sysDSP™
*
Fully
cascadable
slice
architecture
*
12
to
160
slices
for
high
performance
multiply
and
accumulate
*
Powerful
54-bit
ALU
operations
*
Time
Division
Multiplexing
MAC
Sharing
*
Rounding
and
truncation
*
Each
slice
supports
*
Half
36
x
36,
two
18
x
18
or
four
9
x
9
multipliers
*
Advanced
18
x
36
MAC
and
18
x
18
Multiply-Multiply-Accumulate
(MMAC)
operations
*
Flexible
Memory
Resources
*
Up
to
1.944
Mb
sysMEM™
Embedded
Block
RAM
(EBR)
*
194K
to
351K
bits
distributed
RAM
*
sysCLOCK
Analog
PLLs
and
DLLs
*
Four
DLLs
and
four
PLLs
in
LAE5-45;
two
DLLs
and
two
PLLs
in
LAE5-25
and
LAE5-12
*
Pre-engineered
Source
Synchronous
I/O
*
DDR
registers
in
I/O
cells
*
Dedicated
read/write
levelling
functionality
*
Dedicated
gearing
logic
*
Source
synchronous
standards
support
*
ADC/DAC,
7:1
LVDS,
XGMII
*
High
Speed
ADC/DAC
devices
*
Dedicated
DDR2/DDR3
and
LPDDR2/LPDDR3
memory
support
with
DQS
logic,
up
to
800
Mb/s
data-rate
*
Programmable
sysI/O™
Buffer
Supports
Wide
Range
of
Interfaces
*
On-chip
termination
*
LVTTL
and
LVCMOS
33/25/18/15/12
*
SSTL
18/15
I,
II
*
HSUL12
*
LVDS,
Bus-LVDS,
LVPECL,
RSDS,
MLVDS
*
subLVDS
and
SLVS,
MIPI
D-PHY
input
interfaces
*
Flexible
Device
Configuration
*
Shared
bank
for
configuration
I/Os
*
SPI
boot
flash
interface
*
Dual-boot
images
supported
*
Slave
SPI
*
TransFR™
I/O
for
simple
field
updates
*
Single
Event
Upset
(SEU)
Mitigation
Support
*
Soft
Error
Detect
–
Embedded
hard
macro
*
Soft
Error
Correction
–
Without
stopping
user
operation
*
Soft
Error
Injection
–
Emulate
SEU
event
to
debug
system
error
handling
*
System
Level
Support
*
IEEE
1149.1
and
IEEE
1532
compliant
*
Reveal
Logic
Analyzer
*
On-chip
oscillator
for
initialization
and
generaluse
*
1.1
V
core
power
supply
Descriptions of LAE5UM-25F-7BG381E
The
ECP5
Automotive
family
of
FPGA
devices
is
optimized
to
deliver
high
performance
features
such
as
an
enhanced
DSP
architecture,
high
speed
SERDES
and
high
speed
source
synchronous
interfaces
in
an
economical
FPGA
fabric.
Environmental
&
Export
Classifications
of
LAE5UM-25F-7BG381E
ATTRIBUTE | DESCRIPTION |
RoHS Status | ROHS3 Compliant |
Moisture Sensitivity Level (MSL) | 3 (168 Hours) |
REACH Status | REACH Unaffected |
ECCN | EAR99 |
HTSUS | 8542.39.0001 |