| Price | USD9.99-99.99/PCS |
| MOQ | 1PCS |
| Delivery Time | 8-9 working days |
| Brand | Bicheng |
| Place of Origin | CHINA |
| Certification | UL, ISO9001, IATF16949 |
| Packaging Details | Vacuum bags+Cartons |
| Payment Terms | T/T |
| Supply Ability | 5000PCS per month |
| Copper weight | 1oz (1.4 mils) outer layers | Place of Origin | CHINA |
| Packaging Details | Vacuum bags+Cartons | Material | F4BTM300 |
| PCB size | 84.33mm x 59.5 mm=2Types = 2PCS, +/- 0.15mm | Supply Ability | 5000PCS per month |
| Certification | UL, ISO9001, IATF16949 | Brand Name | Bicheng |
| Payment Terms | T/T | Layer count | 2-layer |
| Surface finish | Immersion gold | Price | USD9.99-99.99/PCS |
| Delivery Time | 8-9 working days | Minimum Order Quantity | 1PCS |
| PCB Thickness | 40 mil |
In the rapidly evolving world of high-frequency electronic systems, the demand for reliable and high-performance printed circuit boards (PCBs) has never been more crucial. Wangling, a leading innovator in the field of advanced materials, has answered this call with the introduction of the F4BTM300 – a groundbreaking 2-layer rigid PCB designed to push the boundaries of microwave, RF, and radar technologies.
At the heart of the F4BTM300 is Wangling's proprietary dielectric formulation, which seamlessly blends fiberglass cloth, nano-ceramic fillers, and polytetrafluoroethylene (PTFE) resin. This scientific approach to material engineering has resulted in a laminate that boasts an impressive set of electrical and thermal properties, making it an ideal choice for a wide range of high-frequency applications.
Unparalleled
Electrical
Performance
The
F4BTM300
series
is
built
upon
the
foundation
of
Wangling's
renowned
F4BM
dielectric
layer,
but
it
takes
performance
to
new
heights
through
the
strategic
incorporation
of
high-dielectric
and
low-loss
nano-ceramics.
This
innovative
approach
has
yielded
a
dielectric
constant
(Dk)
of
3.0
at
10GHz,
a
remarkable
achievement
that
enables
designers
to
work
with
tighter
circuit
dimensions
and
achieve
higher
packing
densities
without
sacrificing
signal
integrity.
Complementing the exceptional Dk is an equally impressive dissipation factor (Df) of just 0.0018 at 10GHz. This exceptionally low loss characteristic ensures that signal transmission through the F4BTM300 PCB is efficient and well-preserved, minimizing power dissipation and thermal management challenges.
| Product Technical Parameters | Product Models & Data Sheet | ||||||
| Product Features | Test Conditions | Unit | F4BTM298 | F4BTM300 | F4BTM320 | F4BTM350 | |
| Dielectric Constant (Typical) | 10GHz | / | 2.98 | 3.0 | 3.2 | 3.5 | |
| Dielectric Constant Tolerance | / | / | ±0.06 | ±0.06 | ±0.06 | ±0.07 | |
| Loss Tangent (Typical) | 10GHz | / | 0.0018 | 0.0018 | 0.0020 | 0.0025 | |
| 20GHz | / | 0.0023 | 0.0023 | 0.0026 | 0.0035 | ||
| Dielectric Constant Temperature Coefficient | -55 º~150ºC | PPM/℃ | -78 | -75 | -75 | -60 | |
| Peel Strength | 1 OZ F4BTM | N/mm | >1.6 | >1.6 | >1.6 | >1.6 | |
| 1 OZ F4BTME | N/mm | >1.4 | >1.4 | >1.4 | >1.4 | ||
| Volume Resistivity | Standard Condition | MΩ.cm | ≥1×10^7 | ≥1×10^7 | ≥1×10^7 | ≥1×10^7 | |
| Surface Resistivity | Standard Condition | MΩ | ≥1×10^6 | ≥1×10^6 | ≥1×10^6 | ≥1×10^6 | |
| Electrical Strength (Z direction) | 5KW,500V/s | KV/mm | >26 | >30 | >32 | >32 | |
| Breakdown Voltage (XY direction) | 5KW,500V/s | KV | >34 | >35 | >40 | >40 | |
| Coefficientof Thermal Expansion | XY direction | -55 º~288ºC | ppm/ºC | 15,16 | 15,16 | 13,15 | 10,12 |
| Z direction | -55 º~288ºC | ppm/ºC | 78 | 72 | 58 | 51 | |
| Thermal Stress | 260℃, 10s,3 times | No delamination | No delamination | No delamination | No delamination | ||
| Water Absorption | 20±2℃, 24 hours | % | ≤0.05 | ≤0.05 | ≤0.05 | ≤0.05 | |
| Density | Room Temperature | g/cm3 | 2.25 | 2.25 | 2.20 | 2.20 | |
| Long-Term Operating Temperature | High-Low Temperature Chamber | ℃ | -55～+260 | -55～+260 | -55～+260 | -55～+260 | |
| Thermal Conductivity | Z direction | W/(M.K) | 0.42 | 0.42 | 0.50 | 0.54 | |
| PIM | Only applicable to F4BTME | dBc | ≤-160 | ≤-160 | ≤-160 | ≤-160 | |
| Flammability | / | UL-94 | V-0 | V-0 | V-0 | V-0 | |
| Material Composition | / | / |
PTFE,
Fiberglass
Cloth,
nano-ceramics F4BTM paired with ED copper foil, F4BTME paired with reverse-treated (RTF) copper foil. |
||||
Thermal
Resilience
and
Dimensional
Stability
High-frequency
electronic
systems
often
operate
in
demanding
environments,
where
thermal
stability
and
dimensional
precision
are
critical
factors.
The
F4BTM300
PCB
has
been
engineered
to
excel
in
these
areas,
boasting
a
low
thermal
coefficient
of
dielectric
constant
(-78
ppm/°C)
and
a
carefully
balanced
coefficient
of
thermal
expansion
(CTE)
across
the
x,
y,
and
z-axes.
The x-axis CTE of 15 ppm/°C, y-axis CTE of 16 ppm/°C, and z-axis CTE of 78 ppm/°C ensure that the PCB maintains dimensional stability and minimizes the risk of warping or deformation, even when subjected to temperature extremes ranging from -55°C to 288°C. This level of thermal resilience is a game-changer for designers, allowing them to confidently integrate the F4BTM300 into their most demanding applications without compromising reliability or performance.
Tailored
for
High-Frequency
Applications
The
capabilities
of
the
F4BTM300
PCB
extend
far
beyond
its
exceptional
electrical
and
thermal
properties.
Wangling
has
also
developed
two
variants,
the
F4BTM300
and
the
F4BTME300,
to
cater
to
the
specific
needs
of
different
high-frequency
applications.
The F4BTM300 is paired with electrodeposited (ED) copper foil, making it an ideal choice for applications that do not require stringent passive intermodulation (PIM) performance. This variant offers excellent signal integrity, precise line control, and low conductor loss, making it a go-to solution for a wide range of microwave, RF, and radar systems.
On the other hand, the F4BTME300 is paired with reverse-treated (RTF) copper foil, providing superior PIM performance, more precise line control, and even lower conductor loss. This variant is particularly well-suited for applications where PIM mitigation is a critical requirement, such as in phase shifters, power dividers, couplers, and combiners used in phased array antennas and satellite communications.
| PCB Material: | PTFE / glass fiber cloth / Nano-ceramic filler | ||
| Designation (F4BTM ) | F4BTM | DK (10GHz) | DF (10 GHz) |
| F4BTM298 | 2.98±0.06 | 0.0018 | |
| F4BTM300 | 3.0±0.06 | 0.0018 | |
| F4BTM320 | 3.2±0.06 | 0.0020 | |
| F4BTM350 | 3.5±0.07 | 0.0025 | |
| Layer count: | Single Sided, Double Sided PCB, Multilayer PCB, Hybrid PCB | ||
| Copper weight: | 0.5oz (17 µm), 1oz (35µm), 2oz (70µm) | ||
| Dielectric thickness (or overall thickness) | 0.25mm, 0.508mm, 0.762mm, 0.8mm, 1.0mm, 1.016mm, 1.27mm, 1.524mm, 2.0mm, 3.0mm, 4.0mm, 5.0mm, 6.0mm, 8.0mm, 10.0mm, 12.0mm | ||
| PCB size: | ≤400mm X 500mm | ||
| Solder mask: | Green, Black, Blue, Yellow, Red etc. | ||
| Surface finish: | Bare copper, HASL, ENIG, Immersion silver, Immersion tin, OSP, Pure gold, ENEPIG etc.. | ||
Reliable
and
Versatile
To
ensure
the
highest
levels
of
reliability,
the
F4BTM300
PCB
has
been
designed
and
manufactured
to
the
exacting
standards
of
IPC-Class-2
quality.
This
certification,
combined
with
a
moisture
absorption
of
less
than
0.05%
and
a
flammability
rating
of
UL-94
V0,
underscores
Wangling's
commitment
to
delivering
products
that
can
withstand
the
rigors
of
demanding
environments.
The versatility of the F4BTM300 PCB is further enhanced by its comprehensive set of construction details. With a finished board thickness of 1.1mm, 35μm copper layers, and a minimum trace/space of 4/6 mils, this laminate can be seamlessly integrated into a wide range of high-frequency electronic systems, from microwave and radar to phase-sensitive antennas and satellite communications.
Unlocking
the
Future
of
Microwave
Technology
As
the
demand
for
higher
performance,
greater
reliability,
and
increased
miniaturization
in
high-frequency
electronic
systems
continues
to
grow,
Wangling's
F4BTM300
PCB
stands
as
a
beacon
of
innovation,
poised
to
transform
the
way
designers
approach
the
challenges
of
the
microwave
age.
With
its
unparalleled
electrical
and
thermal
properties,
tailored
variants,
and
unwavering
commitment
to
quality,
this
groundbreaking
laminate
is
set
to
unlock
new
frontiers
in
microwave
technology,
paving
the
way
for
a
future
of
unprecedented
performance
and
reliability.
