| Price | USD9.99-99.99/PCS |
| MOQ | 1PCS |
| Delivery Time | 8-9 working days |
| Brand | Bicheng |
| Place of Origin | CHINA |
| Certification | UL, ISO9001, IATF16949 |
| Packaging Details | Vacuum bags+Cartons |
| Payment Terms | T/T |
| Supply Ability | 5000PCS per month |
| Copper weight | 1oz (1.4 mils) outer layers | Place of Origin | CHINA |
| PCB thickness | 1 mm | Packaging Details | Vacuum bags+Cartons |
| Material | F4BM220 | PCB size | 45mm x 62 mm=1PCS, +/- 0.15mm |
| Supply Ability | 5000PCS per month | Certification | UL, ISO9001, IATF16949 |
| Brand Name | Bicheng | Payment Terms | T/T |
| Layer count | 2-layer | Surface finish | Immersion tin |
| Price | USD9.99-99.99/PCS | Delivery Time | 8-9 working days |
| Minimum Order Quantity | 1PCS |
Wangling's F4BM220 laminates represent a cutting-edge advancement in PCB technology. Crafted with a meticulous blend of fiberglass cloth, polytetrafluoroethylene resin, and polytetrafluoroethylene film, the F4BM220 sets a new standard for electrical performance and stability. With enhanced insulation resistance and reduced dielectric loss, this PCB outshines its predecessor, the F4B220, and is a competitive alternative to foreign products in the market.
Key Features:
Dielectric
Constant
(Dk):
2.2
at
10GHz
Dissipation
Factor:
0.001
at
10GHz
Coefficient
of
Thermal
Expansion
(CTE):
x-axis
25
ppm/°C,
y-axis
34
ppm/°C,
z-axis
240
ppm/°C
(-55°C
to
288°C)
Low
Thermal
Coefficient
of
Dk:
-142
ppm/°C
(-55°C
to
150°C)
Moisture
Absorption:
≤0.08%
Flammability:
UL-94
V0
| PCB Capability (F4BM) | |||
| PCB Material: | PTFE glass fiber cloth copper clad laminates | ||
| Designation (F4BM ) | F4BM | DK (10GHz) | DF (10 GHz) |
| F4BM217 | 2.17±0.04 | 0.0010 | |
| F4BM220 | 2.20±0.04 | 0.0010 | |
| F4BM233 | 2.33±0.04 | 0.0011 | |
| F4BM245 | 2.45±0.05 | 0.0012 | |
| F4BM255 | 2.55±0.05 | 0.0013 | |
| F4BM265 | 2.65±0.05 | 0.0013 | |
| F4BM275 | 2.75±0.05 | 0.0015 | |
| F4BM294 | 2.94±0.06 | 0.0016 | |
| F4BM300 | 3.00±0.06 | 0.0017 | |
| Layer count: | Single Sided, Double Sided PCB, Multilayer PCB, Hybrid PCB | ||
| Copper weight: | 0.5oz (17 µm), 1oz (35µm), 2oz (70µm) | ||
| Dielectric thickness (or overall thickness) | 0.127mm (dielectric), 0.2mm, 0.25mm, 0.5mm, 0.508mm, 0.762mm, 0.8mm, 1.0mm, 1.5mm, 1.524mm, 1.575mm, 2.0mm, 2.5mm, 3.0mm, 4.0mm, 5.0mm, 6.0mm, 8.0mm, 10.0mm, 12.0mm | ||
| PCB size: | ≤400mm X 500mm | ||
| Solder mask: | Green, Black, Blue, Yellow, Red etc. | ||
| Surface finish: | Bare copper, HASL, ENIG, Immersion silver, Immersion tin, OSP, Pure gold, ENEPIG etc.. | ||
This PCB stackup comprises two copper layers with a thickness of 35 μm each, separated by a 1.00 mm F4BM220 core. The board dimensions are precisely set at 45mm x 62mm with a tolerance of ±0.15mm, suitable for various compact applications. The minimum trace/spacing requirements are 4/7 mils, with a minimum hole size of 0.3mm, facilitating intricate circuit designs.
A finished board thickness of 1.1mm, a copper weight of 1oz (1.4 mils) on outer layers, and a 20 μm via plating thickness contribute to this PCB's robust construction. The surface finish is achieved with immersion tin, while the top solder mask is green, and the top silkscreen is white. Prior to shipment, each PCB undergoes 100% electrical testing to ensure quality and reliability.
Supplied in Gerber RS-274-X format and adhering to IPC-Class-2 quality standards, the F4BM220 2-layer rigid PCB is available worldwide.
Typical Applications:
Microwave,
RF,
and
radar
systems
Phase
shifters
Power
dividers,
couplers,
combiners
Feed
networks
Phase-sensitive
antennas,
phased
array
antennas
Satellite
communications
Base
station
antennas
