4 Layer 0.4mm FR4 PCB Board with Immersion Silver For Security Systems

Price	USD9.99-99.99
MOQ	1PCS
Delivery Time	8-9 working days
Brand	Bicheng
Place of Origin	CHINA
Certification	UL, ISO9001, IATF16949
Model Number	BIC-469.V1.0
Packaging Details	Vacuum bags+Cartons
Payment Terms	T/T
Supply Ability	5000PCS per month

Product Details

Product Specification

Copper weight	1oz	Silkscreen	White
Place of Origin	CHINA	PCB thickness	0.5mm ±0.1
Packaging Details	Vacuum bags+Cartons	PCB size	111 x 45mm=1PCS
Model Number	BIC-469.V1.0	Supply Ability	5000PCS per month
Solder mask	Green	Certification	UL, ISO9001, IATF16949
Brand Name	Bicheng	Payment Terms	T/T
Layer count	4 Layers	Surface finish	Immersion Silver
Price	USD9.99-99.99	Delivery Time	8-9 working days
Minimum Order Quantity	1PCS	Base material	FR-4

Product Description

Immersion Silver PCB on 0.4mm FR-4 ITEQ 4 Layer Circuit Board for Security Systems

1.1 General description

This is a type of 4 layer printed circuit board built on FR-4 substrate with mid-Tg 150°C for the application of Security Systems. It's only 0.4 mm thick with white silkscreen(Taiyo) on green solder mask (Nanya) and immersion silver on pads. The base material is from Taiwan ITEQ supplying 1 up PCB per panel. They're fabricated per IPC 6012 Class 2 using supplied Gerber data. Each 30 boards are packed for shipment.

1.2 Features and benifits

Very Low Moisure Absorption and better CAF resistance

Good solderability

16000 square meter workshop

Meeting your PCB needs from prototype to mass production.

UL recognized and RoHS Directive-compliant

Customer complaint rate: <1%

1.3 Applications

Medium Access Control

Speaker System

Broadband Modem

Vfd Drive

Module GSM

Gate Access Control

1.4 Parameter and data sheet

PCB SIZE	111 x 45mm=1PCS
BOARD TYPE	Multilayer PCB
Number of Layers	4 Layers
Surface Mount Components	YES
Through Hole Components	YES
LAYER STACKUP	copper ------- 18um(0.5oz)+plate TOP layer
	PP 2116 x 1
	copper ------- 18um(0.5oz)
	FR-4 0.1mm
	copper ------- 18um(0.5oz)
	PP 2116 x 1
	copper ------- 18um(0.5oz)+plate BOT Layer
TECHNOLOGY
Minimum Trace and Space:	6.99mil/8.47mil
Minimum / Maximum Holes:	0.399mm/3.556mm
Number of Different Holes:	7
Number of Drill Holes:	1521
Number of Milled Slots:	0
Number of Internal Cutouts:	0
Impedance Control	no
BOARD MATERIAL
Glass Epoxy:	FR-4, ITEQ IT-158, Tg>150 °C
Final foil external:	1oz
Final foil internal:	0.5oz
Final height of PCB:	0.5mm ±0.1
PLATING AND COATING
Surface Finish	Immersion Silver, Ag>0.15µm
Solder Mask Apply To:	Top and Bottom, 12micon Minimum.
Solder Mask Color:	Green, LP-4G G-05, Nanya supplied
Solder Mask Type:	LPSM
CONTOUR/CUTTING	Routing
MARKING
Side of Component Legend	TOP
Colour of Component Legend	White, S-380W, Taiyo Supplied.
Manufacturer Name or Logo:	Marked on the board in a conductor and leged FREE AREA
VIA	Plated Through Hole(PTH), via tented.
FLAMIBILITY RATING	UL 94-V0 Approval MIN.
DIMENSION TOLERANCE
Outline dimension:	0.0059" (0.15mm)
Board plating:	0.0030" (0.076mm)
Drill tolerance:	0.002" (0.05mm)
TEST	100% Electrical Test prior shipment
TYPE OF ARTWORK TO BE SUPPLIED	email file, Gerber RS-274-X, PCBDOC etc
SERVICE AREA	Worldwide, Globally.

1.5 ITEQ Laminate/ Prepreg : IT-140TC / IT-140BS

Property	Thickness<0.50 mm		Thickness≧0.50 mm		Units	Test Method
	[0.0197 in]		[0.0197 in]		Units	Test Method
	Typical Value	Spec	Typical Value	Spec	Metric	IPC-TM-650
	Typical Value	Spec	Typical Value	Spec	(English)	(or as noted)
Peel Strength, minimum					N/mm	2.4.8
A. Low profile copper foil and very low profile copper foil - all copper weights > 17mm [0.669 mil]					(lb/inch)	2.4.8.2
B. Standard profile copper foil	0.96 (5.5)	0.70 (4.0)	0.96 (5.5)	0.70 (4.0)		2.4.8.3
1. After Thermal Stress
2. At 125°C [257 F]
3. After Process Solutions	1.75 (10 )	0.80 (4.57)	1.93 (11.0)	1.05 (6.00)
	1.66 (9.5)	0.70 (4.00)	1.66 (9.5)	0.70 (4.00)
	1.49 (8.5)	0.55 (3.14)	1.49 (8.5)	0.80 (4.57)
Volume Resistivity, minimum					MW-cm	2.5.17.1
A. C-96/35/90	5x10¹⁰	106	--	--
B. After moisture resistance	--	--	5x10¹⁰	104
C. At elevated temperature E-24/125	5x10¹⁰	103	5x10¹⁰	103
Surface Resistivity, minimum					MW	2.5.17.1
A. C-96/35/90	3.5x10¹⁰	104	--	--
B. After moisture resistance	--	--	3.5x10¹⁰	104
C. At elevated temperature E-24/125	6x10¹⁰	103	6x10¹⁰	103
Moisture Absorption, maximum	0.3	--	0.1	0.8	%	2.6.2.1
Dielectric Breakdown, minimum	--	--	60	40	kV	2.5.6
Permittivity (Dk, 50% resin content)	4.6	5.4	4.6	5.4	--	2.5.5.9
(Laminate & Laminated Prepreg)
A. 1MHz
Loss Tangent (Df, 50% resin content)	0.016	0.035	0.016	0.035	--	2.5.5.9
(Laminate & Laminated Prepreg)
A. 1MHz
Flexural Strength, minimum					N/mm²	2.4.4
A. Length direction	--	--	500-530	415	(lb/in²)
	--	--	(72,500-76,850)	-60,190
B. Cross direction	--	--	430-460	345
	--	--	(62,350-66,700)	-50,140
Arc Resistance, minimum	120	60	120	60	s	2.5.1
Thermal Stress 10 s at 288°C [550.4F],minimum					Rating	2.4.13.1
A. Unetched	Pass	Pass Visual	Pass	Pass Visual
B. Etched	Pass	Pass Visual	Pass	Pass Visual
Electric Strength, minimum	45	30	--	--	kV/mm	2.5.6.2
(Laminate & Laminated Prepreg)	45	30	--	--	kV/mm	2.5.6.2
Flammability,	V-0	V-0	V-0	V-0	Rating	UL94
(Laminate & Laminated Prepreg)	V-0	V-0	V-0	V-0	Rating	UL94
Glass Transition Temperature(DSC)	140	135 minimum	140	135 minimum	˚C	2.4.25
Decomposition Temperature	--	--	305	--	˚C	2.4.24.6
Decomposition Temperature	--	--	305	--	˚C	(5% wt loss)
Z-Axis CTE						2.4.24
A. Alpha 1	--	--	55	--	ppm/˚C
B. Alpha 2	--	--	290	--	ppm/˚C
C. 50 to 260 Degrees C	--	--	4.2	--	%
Thermal Resistance						2.4.24.1
A. T260	--	--	15	--	Minutes
B. T288	--	--	2	--	Minutes
CAF Resistance	--	--	Pass	AABUS	Pass/Fail	2.6.25